From the data center to the mobile edge, Rambus creates innovative security, memory and interface products that protect and deliver the world’s data
In our increasingly connected world, mobile devices are tasked with generating and storing a significant amount of sensitive data for a wide variety of applications.
Rambus recently announced the launch of its 56G Multi-protocol SerDes (MPS) PHY developed on second-gen FinFET (Fin Field Effect Transistor) process technology.
Rambus recently announced the availability of its new High Bandwidth Memory (HBM) Gen2 PHY.
The IoT is expected to comprise 20.8 billion devices by 2020, with Gartner estimating that 5.5 million new “things” went online daily during 2016.
OEM customers routinely request personalized silicon with customization of standard parts.
The pay TV security paradigm has evolved considerably over the years. Since the 1990s, set-top boxes (STBs) have been secured by Conditional Access System (CAS) smart cards.
Physical electronic systems routinely leak information about the internal process of computing. In practical terms, this means attackers can exploit various side-channel techniques to gather data and extract secret cryptographic keys.
Dave Altavilla recently penned an article for Forbes about the critical role FPGAs are playing in helping to build reconfigurable data centers and advance the development of artificial intelligence (AI).
CryptoManager creates a trusted path from the SoC manufacturing supply chain to downstream service providers with a complete silicon-to-cloud security solution.
The dynamics of managing and processing information have changed, and are continuing to do so at a breakneck pace as more and more “smart things” are created, connected and begin producing data.
Wikipedia defines a smart city as an “urban development vision” that seeks to securely integrate multiple information and communication technology (ICT) and Internet of Things (IoT) solutions for residents.
The semiconductor industry is unable to depend on performance and power efficiency gains from Moore’s Law.
The end of Dennard Scaling and slowdown of Moore’s Law couldn’t have arrived at a more inopportune time for the semiconductor industry. To be sure, the burgeoning Internet of Things (IoT) has ushered in a new era of pervasive connectivity and generated an almost exponential growth of data.
DDR4 memory delivers up to 1.5x performance improvement over DDR3, while reducing power by 25% on the memory interface. The current generation of DDR4 memory deployed in datacenters runs at 2.4Gbps, although 3.2 Gbps silicon is expected to start shipping later this year (2016).
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